Introduction

Advanced Power Semiconductor Wafer Machining Expo 2027

We are pleased to announce that the “Advanced Power Semiconductor Wafer Machining Expo 2027” will be held over three days from Wednesday, March 10 to Friday, March 12, 2027, at Makuhari Messe in Chiba Prefecture, concurrently with “GTJ2027,” the specialized exhibition for grinding technology.
This exhibition is one of the largest specialized trade shows in Japan dedicated to state-of-the-art technologies and solutions for wafer processing used in next-generation power semiconductors such as SiC (silicon carbide), GaN (gallium nitride), and diamond. It will showcase the latest technologies and products covering all phases of the wafer manufacturing process, including slicing, grinding, lapping, CMP, cleaning, inspection and evaluation, equipment, and materials.
At the previous “SiC, GaN Machining Technology Exhibition”, despite being the first event of its kind, we welcomed a large number of exhibitors and visitors, and the exhibition concluded with great success.
For this second edition, the exhibition will expand its scope beyond SiC and GaN to include diamond, gallium oxide (Ga₂O₃), and other cutting-edge WBG (wide bandgap) semiconductor materials. Accordingly, the event name will be changed from the “SiC, GaN Machining Technology Exhibition” to the “Advanced Power Semiconductor Wafer Machining Expo,” marking a fresh new start. Furthermore, in addition to the conventional wafer-making processes (such as slicing, grinding, and polishing), this year’s exhibition will also cover device manufacturing processes (including dicing, back grinding, and planarization CMP) with the aim of attracting an even broader range of exhibitors and visitors.